NASDAQ : AMKR

Amkor Technology, Inc. — Company profile

Technology · Semiconductor Equipment & Materials · United States

Last price 39.5 USD (Oct 30, 2026, 4:00 PM EDT) · Market cap 9.79B

Overview · Financial statements · Key statistics · Dividends · Company profile · Price history · Reports

Company profile

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

Details

NameAmkor Technology, Inc.
SectorTechnology
IndustrySemiconductor Equipment & Materials
Employees30800
Founded1968
Ipo Date1998-04-29
CeoKevin Engel
CountryUnited States
ExchangeNASDAQ
Fiscal YearJanuary - December
Reporting CurrencyUSD
IsinUS0316521006
Cusip031652100
Cik0001047127
Sic3674

Key executives

NameTitle
Kevin K. EngelChief Executive Officer, President and Director
Susan Y. KimChairman
Megan Faust CPAExecutive Vice President, Chief Financial Officer and Treasurer
Mark N. Rogers J.D.Executive Vice President, General Counsel and Corporate Secretary
Farshad HaghighiExecutive Vice President and Chief Sales Officer
John Don LiuExecutive Vice President, Corporate Development and Strategy
Cherie BuntynSenior Vice President and Chief Accounting Officer
Jennifer JueVice President of Investor Relations and Finance
JinAn LeeExecutive Vice President of Worldwide Manufacturing

Contact

Address2045 East Innovation Circle, Tempe, Arizona 85284, United States
Phone480 821 5000
Websitehttps://amkor.com